5 EASY FACTS ABOUT ELECTROMAGNETIC SHIELDING MATERIALS DESCRIBED

Our Molybdenum-copper and tungsten-copper composites are used in electronic packaging thermal management purposes. These include: Chip mounting015 dB cm2 g−1. A lot more amazing would be that the Ag@C hybrid sponge confirmed superhydrophobicity and corrosion resistance a result of the wrapped carbon layer, which solved the problem that metals are